樂(lè)泰ABP 8066T導(dǎo)電銀膠
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LOCTITE ABLESTIK ABP 8066T provides the following
product character istics:
Techno logy Hybr id chemistry
Appearance Si Iver paste
Cure Heat cure
Product Benefits●
High therma | conductivity
High electr ical conductivity
Long open t ime
High die shear str ength
Dispensable silver paste
Appl ication Die attach
Key Substrates Most metals and Plastics
Typical AppI icat ions
LOCTITE ABLESTIK ABP 8066T highly filled， conductiv
e die attach
adhesive is designed to provide high therma I
ande|
ectr ica |
conductivity in the attachment of integrated circui
ts and components
onto metallic leadframes. The material is hydr ophob
ic and stable at
hi gh temperatures. It is formulated to provide high
heat transfer
generated by power devices. This material can also?
be used as a soft
